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IMSE 250 Quiz #10 through #23

Terms in this set (136)

Most cutting processes are __________
(A) three-dimensional. (B) orthogonal cutting.
A
Generally speaking, the _______ the rake angle, the sharper the cutting edge.
(A) larger (B) smaller
A
As shear angle increases, the chip thickness ________
(A) increases. (B) decreases.
B
The magnitude of the shear angle is of fundamental importance. For any given uncut chip thickness, a small shear angle means a ______ cutting force.
(A) high (B) low
A
When the dept of cut increases, the cutting force will typically __________.
(A) increase (B) decrease
A
According to the video, when the cutting fluid is applied into cutting zone, many things will happen. Which one of the following will NOT happen?
(A) The shear angle increases.
(B) Cutting temperature decreases.
(C) BUE disappears.
(D) Power consumption decreases.
(E) Actual clearance angle decreases.
E
An ideal cutting fluid has many benefits. Which one of the following is NOT one of these benefits?
(A) To increase tool life.
(B) To create no or less rust on machine tool.
(C) To create no or less pollution to environment.
(D) To increase the yield strength of workpiece material.
D
The desired qualities for an ideal tool material are: harder than workpiece; retain hardness at high temperature; resist wear and thermal shock; impact resistant; chemically inert. Which one of the following tool materials incorporates all these qualities?
(A) Diamond. (B) Ceramics. (C) HSS. (D) None of them.
D
Which deposition method has higher depositing temperature?
(A) CVD (Chemical Vapor Deposition). (B) PVD (Physical Vapor Deposition).
A
A friend of yours has got a job as an applications engineer in a grinding wheel company (he goes to customers' sites to conduct grinding tests, demonstrating the high performance of their grinding wheels.) They have two types of superabrasives grinding wheels: diamond and CBN. His customers mainly manufacture steel parts for automobile industry. He knows you have taken IMSE 250 and comes to you for advice. Which type of superabrasives should he choose?
(A) Diamond. (B) CBN.
B
Flank wear occurs on _______________
(A) the tool face that interacts with the newly-generated chip.
(B) the tool face that interacts with the newly-generated surface of workpiece.
B
Generally speaking, a decrease in cutting speed will ____________ the tool life.
(A) increase (B) decrease
A
Whether the chip is continuous or discontinuous is determined by several factors. Which one of the following has the least effects on the chip type?
(A) Machine tool horsepower. (B) Workpiece material (brittle or ductile).
(C) Cutting speed. (D) Tool rake angle.
(E) Whether the cutting tool is in continuous contact with workpiece.
A
For a standard twist drill, the rake angle along the main cutting edges (lips) is _________
(A) different at different point. (B) the same everywhere
A
Which one of the following orders represents the surface roughness order (from the roughest to the smoothest) generated by these processes?
(A) Honing > Reaming > Drilling. (B) Reaming > Drilling > Honing.
(C) Drilling > Reaming > Honing. (D) Drilling > Honing > Reaming
C
Holes are drilled in a part. It is found that the hole surface is too rough. You are asked to judge if the following ideas will improve the surface quality.
Use a honing operation after drilling.
(A) Probably will. (B) Will not.
A
Holes are drilled in a part. It is found that the hole surface is too rough. You are asked to judge if the following ideas will improve the surface quality.
Increase drill rotational speed.
(A) Probably will. (B) Will not.
A
Holes are drilled in a part. It is found that the hole surface is too rough. You are asked to judge if the following ideas will improve the surface quality.
Increase feedrate.
(A) Probably will. (B) Will not
B
Holes are drilled in a part. It is found that the hole surface is too rough. You are asked to judge if the following ideas will improve the surface quality.
Use a reaming operation after drilling.
(A) Probably will. (B) Will not
A
Which one of the following statements is NOT true regarding a honing operation?
(A) The tool used is a stone made by bonded abrasives.
(B) It removes a small amount of material from the surface of holes (or external and flat surfaces).
(C) It cannot remove common errors left by boring (taper, waviness, tool marks).
(D) It can remove grinding marks left by grinding.
C
In the equation to calculate the cutting speed in milling, v = (pi)DN, D is the diameter of _____
(A) the workpiece. (B) the hole being machined. (C) the tool.
C
In _____ milling, the surface is generated by teeth located on the periphery (only).
(A) slab (B) face (C) end
A
In a milling operation, if the surface generated is perpendicular to the cutter rotation axis, it is called ________ milling.
(A) slab (B) face
B
Pockets can be machined by __________ milling.
(A) slab (B) face (C) end
C
Up (conventional) milling and down (climb) milling refer to ___________
(A) slab milling only. (B) face milling only. (C) both slab and face milling
C
See the figure below. Cutters for slab milling may have straight or helical teeth. Which one result in oblique cutting action?

(A) Straight teeth.
(B) Helical teeth.
B
When machining very hard materials such as hardened metals and ceramics, grinding operation _______ preferable to turning and milling.
(A) is (B) is NOT
A
Grinding operation is widely used in automotive industry, but has no applications in semiconductor industry.
(A) True (B) False
B
The surface roughness and accuracy produced by grinding is generally ________ that produced by turning or milling.
(A) up to 10 times better than (B) worse than (C) about the same as
A
Superabrasives include CBN and diamond. ______ wheels are used to grind ferrous metals; the other wheels are used to grind non-ferrous metals and nonmetals.
(A) CBN (B) Diamond
A
There are three major bond systems for grinding wheels: vitrified, organic and metal. Which of the following associations is true?
(A) Vitrified -> glass; Organic -> resin. (B) Vitrified -> resin; Organic -> glass.
A
Grain size, bond type and pore size all affect the wheel performance. Which one of the following is NOT true?
(A) Finer grain size produces rougher surface.
(B) Vitrified bond system is more rigid and more brittle than resin bond system.
(C) Pore space determines if the wheel has an "open" structure or "closed" structure.
A
The purpose of truing and dressing is to prepare the grinding wheel to have correct form, concentricity and cutting action. Which one of the following is NOT true?
(A) Truing/dressing is sometimes called balancing.
(B) Some abrasive grains should be removed from the wheel during truing/dressing.
(C) Truing/dressing can be done by using a single-point diamond tool or a multi-point diamond tool.
A
Four primary grinding types are cylindrical, internal, centerless and surface grinding. Which one is true regarding cylindrical grinding?
(A) Both wheel and workpiece rotates.
(B) Wheel rotates and workpiece does not rotate.
(C) Workpiece rotates and wheel does not rotate.
A
Which one of the following is NOT true regarding creep feed grinding?
(A) Depth of cut is much smaller.
(B) The feed rate is much smaller.
(C) It requires much more horsepower.
A
Which one of the following is true for double disk grinding?
(A) Both sides of a grinding wheel are grinding the workpiece.
(B) Both sides of a workpiece are being ground at the same time.
B
) LBM (Laser Beam Machining) and AWM (Abrasive Waterjet Machining) are primarily used to cut _________________ (choose one).
(A) flat sheets (B) cylindrical parts (C) hollow cavities
A
In AWM (Abrasive Waterjet Machining), consumables _______ be used.
(A) will not (B) will
B
Comparing to traditional machining processes (turning and milling, for examples), thermal cutting processes (such as oxygen fuel cutting and plasma arc cutting) will generate ____ accurate tolerances.
(A) more (B)less
B
Generally speaking, which one of the following processes generates the most accurate tolerances?
(A) LBM (Laser Beam Machining)
(B) Oxygen fuel cutting
(C) PAC (Plasma Arc Cutting)
(D) AWM (Abrasive Waterjet Machining)
A
Generally speaking, which process generates more heat-affected zone?
(A) Oxygen fuel cutting. (B) PAC (Plasma Arc Cutting).
(C) AWM (Abrasive Waterjet Machining).
A
LBM (Laser Beam Machining) is used __________________.
(A) primarily for cutting small holes
(B) primarily for cutting large holes
(C) for cutting both small and large holes
C
LBM (Laser Beam Machining) ______ generate cutting forces.
(A) does not (B) does
A
Which one of the following processes does not generate HAZ (Heat Affected Zone)?
(A) LBM (Laser Beam Machining)
(B) Oxygen fuel cutting
(C) PAC (Plasma Arc Cutting)
(D) AWM (Abrasive Waterjet Machining)
D
Which one of the following processes is like a "corrosion" process?
(A) Chemical machining. (B) Electrochemical machining.
(C) Abrasive flow machining. (D) Ultrasonic Machining.
A
Which one of the following processes is the reverse of electroplating?
(A) Chemical machining. (B) Electrochemical machining.
(C) Abrasive flow machining. (D) Ultrasonic Machining.
B
Both USM and RUM are mechanical NTM (Non-Traditional Machining) processes.
(A) True. (B) False.
A
In USM, an abrasive slurry is used while in RUM a fix-abrasive tool is used.
(A) True. (B) False.
A
In both USM and RUM, the tool (or the workpiece) vibrates at very high frequency.
(A) True. (B) False.
A
Both USM and RUM can machine non circular holes and cavities.
(A) True. (B) False.
B
In ultrasonic machining, either the tool or the workpiece vibrates at high frequency.
(A) True. (B) False.
A
EDM (Electrical Discharge Machining) has several benefits. Which one of the following is NOT among these benefits?
(A) No cutting forces. (B) Burr-free edges.
(C) Intricate (complex) details can be cut. (D) The tool never wears.
D
Which one of the following is NOT among the limitations of EDM?
(A) Low material removal rate. (B) Long lead time (to prepare the tool).
(C) Workpiece material must be conductive. (D) Can cut only one hole at a time.
D
In EDM, the longer the on-time, the ________ the surface generated?
(A) rougher (B) finer
A
In EDM, as the on-time increases, the overcut ____________.
(A) increases (B) decreases
A
In wire-EDM, _______________________
(A) a moving wire is used as the tool. (B) wire products are produced.
A
Most products are not made as a single piece. Instead, they consist of more than two parts joined together. Which one of the following is NOT among the reasons for doing so?
(A) It is more economical or easier to manufacture this way.
(B) For maintenance and repair.
(C) Different parts can have different properties.
(D) For ease of transportation.
(E) The joined product is typically stronger than a single piece.
E
Which one of the following welding processes involves melting the base metal (or the filler metal)?
(A) Fusion welding. (B) Solid-State welding.
A
In fusion welding, filler metals ______ used.
(A) will always be (B) will never be (C) may or may not be
C
) In solid state welding, the temperatures at the welding interface ______ the melting point of the workpiece materials.
(A) will not exceed (B) will be higher tha
A
The electrode used in arc welding is __________ (choose one).
(A) always consumable (B) always non-consumable
(C) either consumable or non-consumable
C
Resistance welding is primarily used for welding ______ (choose one).
(A) sheet metals (B) round (bar) metals
A
Resistance welding is in the group of ____________.
(A) Fusion welding. (B) Solid-State welding.
A
In brazing and soldering, filler metals ______ used.
(A) will always be (B) will never be (C) may or may not be
A
The strength of a soldered joint is __________ that of a brazed joint.
(A) higher (B) lower (C) about the same as
B
Riveting is used when _____________________________.
(A) the joined parts will not be separated apart in the future.
(B) the joined parts will be separated apart in the future.
A
A composite material is composed of two or more materials. The individual components __________
attain all the properties of the composite materials.
(A) cannot (B) can
A
Generally speaking, which one of following area has the largest composite consumption?
(A) Space & defense (B) Commercial Aerospace
(C) Industrial (D) Electronic
B
The NASA composite introduction video shows that a tree is a composite material. Please judge this statement.
(A) true (B) false
A
Polywood is one of the composite materials. It belongs to which type of composite?
(A) Fiber composite (B) Particle composite
(C) Laminar composite (D) Flake composite
(E) Filled composite (F) None of above
C
Which one of the following statement is NOT true?
(A) 1-D reinforcement gives maximum strength in one direction
(B) 2-D reinforcement gives maximum strength in two direction
(C) Isotropic gives strength equally in all directions
(D) Isotropic gives strength differently in all directions
D
Composite materials have ________ density than aluminum?
(A) Lower (B) Higher
A
Which one of the fibers has the lowest cost and the most widely used?
(A) Glass (B) Carbon
(C) Boron (D) Ceramic
(E) Metallic (F) None of above
A
Which one of the fibers has high temperature resistance?
(A) Glass (B) Carbon
(C) Boron (D) Ceramic
(E) Metallic
D
Which one of the matrices is most commonly used in industry?
(A) Polymer (B) Metal
(C) Ceramic (D) Carbon
A
Which kind of matrix can be reused?
(A) Thermoset (B) Thermoplastic
B
The "From fibers to finished composite" video shows how to make composite material. Which kind of reinforcement is used?
(A) 1 D (B) 2 D
(C) Isotropic
B
Which one of the following processes belongs to molding process?
(A) Imprenation (B) Curing
(C) Extraction (D) Trimming
B
Curing is the drying and hardening (or polymerization) of the resin matrix of a finished composite. This may be done __________ by applying heat and/or pressure.
(A) unaided (B) aided
(C) unaided or aided
C
Which one of the following processes uses the close-mold?
(A) Vacuum-bag molding (B) Pressure-bag molding
(C) Pultrusion (D) Manual lay-up
(E) Injection molding (F) None of above
E
In Spray-up process, ________ fibers and resins are sprayed simultaneously into or onto the mold.
(A) continuous (B) discontinuous
(C) both continuous and discontinuous
B
Which one of the molding processes appears in the video of "How it's made: Hunting bows"?
(A) Vacuum-bag molding (B) Pressure-bag molding
(C) Pultrusion (D) Manual lay-up
(E) Injection molding (F) None of above
B
In Autoclave Molding process, the pressure ________ reduce time.
(A) can (B) cannot
A
"Some shapes can't be made with filament winding". Please judge this statement.
(A) true (B) false
A
For the thermoset, the melting temperature is ________ than curing temperature.
(A) higher (B) lower
B
The mold is ________ in thermoplastic injection molding.
(A) cooled (B) heated
(C) cooled or heated
A
Which one of the following is NOT part of the reasons for the price decrease of semiconductor chips?
(A) Competition among chip manufacturers.
(B) Use of wafer technology
(C) Decrease of feature size
(D) Increase of wafer size
(E) Use of new semiconductor materials other than silicon
E
Nowadays, the diameter of silicon wafer is around _____.
(A) 100 mm
(B) 200 mm
(C) 300 mm
C
Silicon is the only material used in semiconductor industry?
True or False
False
Moore's Law states that the number of transistors on a trip doubles every ____.
(A) Month
(B) 1.5 Years
(C) 5 Years
B
Which flatness is more related to the wafer yield?
(A) Global flatness
(B) Local flatness
B
TTB (total thickness variation) is a value of ________.
(A) surface roughness (B) flatness
(C) warp (D) subsurface damage
B
Subsurface damages always exist after lapping process?
True of False
True
Dimple method is used to measure _______.
(A) surface roughness
(B) flatness
(C) warp
(D) subsurface damage
D
Taper polishing method is used to measure _______.
(A) surface roughness
(B) flatness
(C) warp
(D) subsurface damage
D
All wafer manufacturing processes are traditional machining methods?
True or False
False
The orientation of the surface shown in the figure is ____.
(A) (111).
(B) (101).
(C) (110).
A
What will determine the diameter of the boule during crystal growth?
(A) Temperature.
(B) Pull rate.
(C) Rotating speed of the seed.
B
If you want a larger boule diameter, which pull rate should be used?
(A) Faster.
(B) Slower.
B
Which one is not the purpose of boule shaping process?
(A) Decrease the surface roughness of boule surface.
(B) Obtain the uniform boule shape.
(C) Generate flats to identify the front and back surfaces.
A
Between wire-sawing and ID sawing, which one yields more wafers per unit length of crystal ingot?
(A) Wire sawing. (B) ID sawing.
A
Warped wafer will be generated from both ID saw and wire saw.
(A) True. (B) False.
A
Between lapping and grinding, which one has higher MRR?
(A) Lapping. (B) Grinding.
B
Between lapping and grinding, which one use fixed abrasives?
(A) Lapping. (B) Grinding.
B
In lapping process, the material of lapping plate is _____ than the wafer material.
(A) Harder (B) Softer
B
The abrasive particles used in polishing process are _____ than those used in lapping?
(A) Smaller. (B) Larger.
A
To fabricate integrated circuits (ICs), three types of materials are needed: conductors, insulators, and semiconductors. Which one of the following is a conductor?
(A) Doped polysilicon. (B) Silicon dioxide. (C) Silicon.
A
If more dopant is added to silicon, then the conductivity of silicon will_______
(A) increase. (B) decrease. (C) remain the same.
A
What is the earliest semiconductor material?
(A) Silicon. (B) Germanium. (C) Gallium arsenide. (D) Carbon.
B
Comparing to silicon, gallium arsenide (GaAs) has several advantages as the semiconductor material for ICs. Which one of the following is true?
(A) GaAs can provide faster speed.
(B) GaAs is more abundant in the earth.
(C) GaAs is cheaper than silicon.
(D) The manufacturing of GaAs chips is less complex than silicon chips.
A
In a MOS transistor, which one of the following controls the current flow?
(A) Source. (B) Gate. (C) Drain.
B
Referring to the figure to the right, the parts labeled X, Y & Z are called respectively _______________
(A) emitter, base, collector.
(B) anode, grid, cathode.
(C) source, drain, gate.
(D) source, gate, drain.
D
Most semiconductor processes occur in the top few _____ of a silicon wafer.
(A) nanometers (B) microns (C) hundreds of microns
B
The flow chart shows some steps in making integrated circuits after silicon wafers are already in IC fabs. Please choose one from the following list to fill the three blanks based on the information provided in the videotape (Silicon Run I).
(A) Removing photoresist, Generating patterns by steppers, Depositing photoresist.
(B) Generating patterns by steppers, Removing photoresist, Depositing photoresist.
(C) Depositing photoresist, Generating patterns by steppers, Removing photoresist.
(D) Depositing photoresist, Removing photoresist, Generating patterns by steppers.
C
___________ is used to obtain a flat surface.
(A) Deposition. (B) Plasma etching.
(C) Photolithography. (D) Chemical-mechanical polishing (CMP).
D
What is the final step in making the ICs according to the video?
(A) Chemical mechanical polishing (CMP).
(B) Doping.
(C) Electrical testing and packaging
C
IC Fabrication involves five general stages. Crystal growing is in the stage of _________
(A) Wafer preparation. (B) Wafer fabrication. (C) Wafer test/sort.
(D) Assembly and packaging. (E) Final test.
A
IC Fabrication involves five general stages. Photolithography is in the stage of _________
(A) Wafer preparation. (B) Wafer fabrication. (C) Wafer test/sort.
(D) Assembly and packaging. (E) Final test.
B
You are at SEMICON West (the premier annual event for the global microelectronics industry) where companies exhibit their products. You are interested in buying a CMP machine for your company. Where should you look for CMP machines?
(A) Front end processes. (B) Back end processes.
A
Which one of the following processes involves separating each good die from the wafer?
(A) Wafer sort testing. (B) Final assembly. (C) Packaging.
B
Among the following three back end IC manufacturing processes, which one is the last step?
(A) Wafer sort testing. (B) Final assembly. (C) Packaging.
C
IC and PCB (Printed circuit boards) are two terms that _____ be used interchangeably.
(A) can (B) cannot
B
There are two different packaging levels for electronic components. The first level packaging is the chip assembly and packaging. In the second level packaging, the IC component is assembled onto a PCB (printed circuit board). The figure above shows a typical product after which level of packaging?
(A) First level. (B) Second level.
B
The completed chips are loaded on burning boards and then put into ovens. The chips will be stressed far beyond normal conditions. The purpose of doing so is to _______
(A) strain harden the chips so they will have higher strength.
(B) force the weak chips to fail prematurely before they are put into products.
B
In burning oven, the chips will be powered up to expose high temperatures for several hours. The purpose of doing so is to ____________
(A) encourage potential defects to occur faster.
(B) heal (fix) the defects in these chips.
A
___________ is used to mount IC components on printed circuit boards (PCB).
(A) Soldering (B) Brazing (C) Welding
A
According to Richard Smalley (1996 Noble Laureate in Chemistry), what is the humanity's top one problem during the next 50 years?

(A) Energy
(B) Water
(C) Food
(D) Terrorism & War
(E) Population
A
Regarding the world energy use today, which type on the following list has the highest percentage?

(A) Renewable Energy
(B) Natural Gas
(C) Coal
(D) Petroleum
(E) Nuclear
D
Regarding the renewable energy use today, which type on the following list has the highest percentage?

(A) Solar and wind
(B) Hydroelectric
(C) Wood and residue
(D) Geothermal
(E) Ethanol
B
Between laptop and toaster, which one uses about 1000 times more energy than the other?

(A) Laptop Computer
(B) Toaster
B
According to the video "Life after oil", future wind farms are most likely to be built______.

(A) In the ocean
(B) on the land
A
According to the video "Life after oil", nuclear power ____ emit CO2 into the atmosphere.

(A) will
(B) will not
B
According top the date from Nate Lewis, the economically feasible hydroelectric energy potential ____ meet the world's energy demand.

(A) will
(B) will not
B
According top the date from Nate Lewis, in comparison to a typical Saudi oil will, the power from a good geothermal well (pair) is about 100 times _____.

(A) higher
(B) lower
B
According top the date from Nate Lewis, which one on the following list is a major problem with solar energy?

(A) There is not enough solar energy potential.
(B) It is challenging to store enough electricity for use when there is no sunshine.
(C) There is not enough land in the U.S. to collect enough solar power.
B
According to the video on "Solar energy", which one on the following list would most likely be our solution for the energy challenge?

(A) Solar energy
(B) Fusion
(C) Biomass
(D) There is no one technology that is going to do the job for us. We are going to need a whole range of technologies.
D
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